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Silicon wafers with 100nm of silver coating

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FIB grids

EM-Tec FIB grids have been devised for lift-out techniques with FIB or SEM/FIB systems.

They offer a secure way to attach TEM lamellas to the posts of the grid. TEM lamellae can then be easily imaged in the SEM/FIB, TEM or used for EBSD analysis. EM-Tec FIB grids are available in multiple post configurations.

The shape of EM-Tec FIB lift-out grids has been optimized for accessibility. EM-Tec FIB lift-out grids are compatible with all standard 3mm TEM grid holders. All EM-Tec FIB lift-out grids have a number etched into the left side of the FIB lift-out grid to distinguish front and back. This number corresponds with the number of posts on the grid. For easy post identification, there are unique symbols beneath each post.

Available both in copper and smooth wall molybdenum.

Copper EM-Tec FIB lift-out grids

Copper EM-Tec FIB lift-out grids are available with either 2, 3, 4 or 5 posts. Thickness is 30-40µm, which makes them more rigid then standard TEM grids. EM-Tec FIB lift-out grids undergo a unique cleaning process to reduce contamination; this results in improved mounting and imaging of the TEM lamellas. Due to the manufacturing process, the copper FIB lift-out grids have a set-back ridge at the edge of the front side and exhibit smooth side walls. EM-Tec copper FIB grids al include unique indicator markers for each post. Packaging size is vial/100.

Smooth side wall Molybdenum EM-Tec FIB lift-out grids

A common problem with Mo FIB lift-out grids is the roughness of the side wall. It takes valuable FIB time to smooth out the sidewall of standard molybdenum FIB lift-out grids to enable secure mounting of the TEM lamellas. To solve this common problem and to reduce cost at the FIB, we have developed smooth side wall Mo EM-Tec FIB lift-out grids. They are made with a unique manufacturing process with the result that smoothing with the FIB is virtually eliminated, or reduced to a fraction of the time previously needed. These unique Mo EM-Tec FIB lift-out grids are available with two, three or four posts and with a thickness of 45-55µm. Packed in a vial with 25 Molybdenum FIB grids.

 

  • Smooth side wall Mo grids
  • Virtually eliminates FIB smoothing before mounting
  • Saves valuable FIB time
  • Reduce overall costs
  • Unique indicating markers for each post
  • Improved lamellae mounting

For FIB grid holders see: this link

Specification Cu FIB lift-out grids
Two-post FIB lift-out grid Three-post FIB lift-out grid Four-post FIB lift-out grid Five-post FIB lift-out grid
Post size 250 x 200µm Post sizes 125 x 200 & 80 x 200µm Post size 80×200µm  post size 60 x 190µm
Attach single lamellas  Attach multiple TEM lamellas Attach many TEM lamellas Attach many TEM lamellas
Specification Mo FIB lift-out grids
 Two- post FIB lift-out grid  Three- post FIB lift-out grid  Four-post FIB lift-out grid  Five-post FIB lift-out grid
 Post size: 250 x 200µm  Post size: 125 x 200 & 80 x 200µm  Post size 80×200µm Post size 60×190µm
 Attach single lamellas per post  Attach multiple TEM lamellas  Attach many TEM lamellas  Attach many TEM lamellas

Ordering information:

EM-TEC FIB lift-out grids